1 | advanced cmp process development | | | | | | | 3 | 0.38% |
2 | the axus technology engineering | | | | | | | 3 | 0.38% |
3 | technology engineering team provides | | | | | | | 3 | 0.38% |
4 | cmp process development to | | | | | | | 3 | 0.38% |
5 | process development to standard | | | | | | | 3 | 0.38% |
6 | services with a fully | | | | | | | 3 | 0.38% |
7 | with a fully equipped | | | | | | | 3 | 0.38% |
8 | a fully equipped class | | | | | | | 3 | 0.38% |
9 | fully equipped class 100 | | | | | | | 3 | 0.38% |
10 | engineers with decades of | | | | | | | 3 | 0.38% |
11 | with decades of semiconductor | | | | | | | 3 | 0.38% |
12 | decades of semiconductor process | | | | | | | 3 | 0.38% |
13 | ready to assist you | | | | | | | 3 | 0.38% |
14 | to assist you with | | | | | | | 3 | 0.38% |
15 | assist you with all | | | | | | | 3 | 0.38% |
16 | you with all your | | | | | | | 3 | 0.38% |
17 | with all your cmp | | | | | | | 3 | 0.38% |
18 | axus technology engineering team | | | | | | | 3 | 0.38% |
19 | call for ultrathin wafers | | | | | | | 2 | 0.25% |
20 | by engineers with decades | | | | | | | 2 | 0.25% |
21 | temporary waxon and tapeon | | | | | | | 2 | 0.25% |
22 | waxon and tapeon bonding | | | | | | | 2 | 0.25% |
23 | class 100 cleanroom staffed | | | | | | | 2 | 0.25% |
24 | permanent wafer bonding and | | | | | | | 2 | 0.25% |
25 | equipped class 100 cleanroom | | | | | | | 2 | 0.25% |
26 | bonding steps although these | | | | | | | 2 | 0.25% |
27 | metrology at every step | | | | | | | 2 | 0.25% |
28 | enhanced temporary bonds where | | | | | | | 2 | 0.25% |
29 | temporary bonds where followon | | | | | | | 2 | 0.25% |
30 | for ultrathin wafers also | | | | | | | 2 | 0.25% |
31 | foundry services with a | | | | | | | 2 | 0.25% |
32 | although these process steps | | | | | | | 2 | 0.25% |
33 | cmp foundry services with | | | | | | | 2 | 0.25% |
34 | bonding of the substrates | | | | | | | 2 | 0.25% |
35 | development to standard production | | | | | | | 2 | 0.25% |
36 | that call for ultrathin | | | | | | | 2 | 0.25% |
37 | applications that call for | | | | | | | 2 | 0.25% |
38 | from advanced cmp process | | | | | | | 2 | 0.25% |
39 | ranging from advanced cmp | | | | | | | 2 | 0.25% |
40 | chemical mechanical planarization process | | | | | | | 2 | 0.25% |